Description
Ceresit CT88 is ideal for filling losses and gaps in the insulation layer of systems based on EPS and XPS polystyrene boards. Its low-pressure application and strong adhesion make it a go-to solution for repairing or upgrading thermal insulation before applying adhesive and render.
Application:
- Filling gaps between EPS and XPS polystyrene boards
- Repairing cavities and damage in EPS/XPS insulation layers
- Replenishing missing adhesive in existing insulation systems
Key Properties:
- Ideal for gap and loss filling in EPS/XPS insulation layers
- Enhanced thermal insulation properties
- Similar insulation value to EPS foam or mineral wool
- Low-pressure formula for safe and easy use
- Snow-white colour – blends with most insulation materials
- Easy to shape and apply
Substrate Preparation:
The filled gaps between insulation boards or any losses in EPS/XPS insulation boards must be free from dust, debris, or loose material. When used at lower temperatures, ensure the substrate is dry and free from frost, ice, or snow for best adhesion.
For full system installation, follow with Ceresit CT85 FLEX adhesive and embed CT325 Mesh before applying render.
